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Witek
I. Heat Dissipation Materials: 1.)LED Lead Frame. 2.)Aluminum Tube. 3.)Graphite Sheet. 4.)Aluminum Substrate.
II. Mechanical Assembly: 1.)Aluminum tube, graphite
sheet, LED light strip,
fixtures.
2.)Power, control module,
covering tube.
3.)AC end cap connector, DC
control end cap connector. 4.)Internal AC power lines, DC
control lines.
III. Light Source Chip: 1.)Chip Size Selection. 2.)Packaging Manufacturer.
3.)Lumen, Color Temperature, Color Rendering Index
4.)Light Combination Efficiency Calculation.
IV. Power Production and Manufacturing::
1.)Fly-back Main Chip Selection. 2.)Main Transformer Winding
Calculation.
3.)Dimming Module Design. 4.)MCU Control Module Design.
V. Control Software Application:: 1.)Multi-key Continuous Control. 2.)Single-key Control. 3.)Passive PIR Timing Control. 4.)Built-in RTC (Real-Time
Clock), Bluetooth BLE (Short- distance Wireless Transmission), RS485 (Wired Multi-node 2 Transmission) 2
I. Heat Dissipation Materials: 1.)LED Lead Frame. 2.)Aluminum Tube. 3.)Graphite Sheet. 4.)Aluminum Substrate.
II. Mechanical Assembly: 1.)Aluminum tube, graphite
sheet, LED light strip,
fixtures.
2.)Power, control module,
covering tube.
3.)AC end cap connector, DC
control end cap connector. 4.)Internal AC power lines, DC
control lines.
III. Light Source Chip: 1.)Chip Size Selection. 2.)Packaging Manufacturer.
3.)Lumen, Color Temperature, Color Rendering Index
4.)Light Combination Efficiency Calculation.
IV. Power Production and Manufacturing::
1.)Fly-back Main Chip Selection. 2.)Main Transformer Winding
Calculation.
3.)Dimming Module Design. 4.)MCU Control Module Design.
V. Control Software Application:: 1.)Multi-key Continuous Control. 2.)Single-key Control. 3.)Passive PIR Timing Control. 4.)Built-in RTC (Real-Time
Clock), Bluetooth BLE (Short- distance Wireless Transmission), RS485 (Wired Multi-node 2 Transmission) 2
